New Components Meet Designer, Buyer Requirements

| August 8, 2014 | 0 Comments
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GinaRoosdeskcrop2Electronic component manufacturers are developing more and more new devices that serve double-duty roles – helping designers simplify and speed up their designs while reducing the bill of materials (BOM) and overall systems cost for the procurement teams. Here’s a sampling of some of the latest devices that play dual roles, including switching regulators, motor drivers, optical sensors and sockets.

Texas Instruments (TI) touts the first fully integrated power solution for bus-powered Thunderbolt applications with the introduction of the TPS65980 switching regulator. This device is the centerpiece of TI’s certified Thunderbolt single port peripheral reference design, which helps simplify the power chain and speed the design of bus-powered applications, such as hard drives, solid state drives and audio and video solutions. The device integrates all the power management functions to meet power requirements for a Thunderbolt bus-powered device, reducing the total bill of materials (BOM) cost by 50 percent and solution size by 40 percent compared to discrete solutions.

The new TC78H610FNG and TB67Z800FTG motor driver ICs from Toshiba America Electronic Components save space, which simplifies design for a wide range of motor applications. Supplied in a SSOP16 package, the TC78H610FNG can reduce the required mounting area by 21 percent compared to products with similar functionality housed in SSOP20 packages. This also helps reduce PCB costs.

Linear Technology has introduced its LT3669 IO-Link PHY compatible (COM1/COM2/COM3) industrial transceiver that integrates a high efficiency step-down regulator and a low dropout linear regulator. The integrated LDO, powered from the switcher output, provides an additional output to offer additional design flexibility while maintaining high efficiency, said Linear. Both versions feature constant frequency/synchronizable operation with programmable switching frequencies between 250 kHz and 2.2 MHz. This enables the use of tiny external components, which combined with the 4mm x 5mm QFN-28, offer a compact solution footprint for industrial IO-Link sensor applications.

The Optoelectronics group of Vishay Intertechnology, Inc. offers a new AEC-Q101-qualified, fully integrated proximity and ambient light optical sensor with an industry-high operating temperature range to +105 °C. The VCNL4020X01 combines an IR emitter, a photo-pin-diode for proximity, an ambient light detector, a signal processing IC, and a 16-bit ADC in one small 4.8 mm x 2.3 mm x 0.8 mm rectangular lead-less (LLP) package. The compact design simplifies window and sensor placement in a wide variety of automotive, consumer, and industrial applications. While other devices use chip-on-printed-circuit-board technology that results in package heights of 1.2 mm or greater, the VCNL4020X01 uses a proprietary technology that delivers the lowest height on the market, giving design engineers greater flexibility in where and how they locate the sensor, said Vishay. The 16-bit resolution of the VCNL4020X01 allows it to be assembled on the main PCB near other components, which helps reduce costs compared to lower resolution devices.

Analog Devices, Inc. has developed a current-to-digital converter module that reduces the cost and complexity of computed tomography (CT) scanner system design.  Touted as the industry’s first 256-channel, 24-bit current-to-digital converter module for CT scanners, the ADAS1131 is available in a 15-mm² BGA package with a 0.8-mm pitch. The device uses approximately 33 percent less PCB area than alternative devices that offer only half the channel density, said Analog Devices. The 0.8-mm pitch package enables designers to mount the ADAS1131 on a standard PCB substrate, which is a less costly and higher yield option than high density, specialized PCB substrates requiring laser vias, said the company.

Meeting customer requirements for design flexibility and cost savings when deploying enterprise-level server systems, Molex has updated its DDR4 DIMM sockets with multiple improvements in both aerodynamic and standard versions, giving design engineers more options and improved performance. The aerodynamic socket features a through-hole termination style and streamlined latch and housing feature for better airflow and space-savings. The standard version features three termination styles: press-fit for solderless processes, surface mount technology for ease of printed circuit board (PCB) trace routing and through hole for cost-effective applications.

This is an excerpt from the July Hot Products newsletter.

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Category: Component Sourcing, Component Trends, Featured Blogs, News Analysis

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